— Research

Research Report, Issue No. 59, 2021. Pushing Forward China’s Health Care Digitalization - 2021-12-24
The digitalization reform of health care is significant to the establishment of modern health care system. The 5th Plenary Session of the 19th CPC Central Committee put that the country would speed up digitalization, strengthen the development of digital society and digital government, and improve digital and intelligent capacities in public services and social governance. To some extent, “Internet plus health care” has provided solutions to healthcare information interconnectivity, and played an important role in streamlining processes, improving efficiency, and optimizing resource allocation. In the new phase for development, deep-lying challenges are emerging, including the poor integration of online and offline healthcare services, isolated healthcare data islands, digital divide in health insurance, and difficulties in digital governance of health insurance, digital coordination of the allocation of health insurance, health care and medicine resources and digital upgrade of health insurance, all of which are calling for solutions provided by digital reform.
Research Report, Issue No. 58, 2021. U.S. Methods of Developing Biomedical Innovation Highland and Its Enlightenment - 2021-12-24
After decades of efforts, the U.S. government, enterprises and science communities have nurtured a strong biomedical science and industry foundation, established an effective innovation system for life sciences, and gradually become a global innovation highland of biomedical innovation. Developing innovation capacities in biomedicine is integral to China’s endeavor to becoming a global science center, which requires the country to learn from the U.S. experience.
Research Report, Issue No. 57, 2021. Deploying a New Racing Track in Advanced Semiconductor Packaging - 2021-12-24
As Moore’s Law nears its physical limits, the complexity and cost of advanced processing are soaring, leaving less room for further improvement. Advanced packaging is supposed to make chip better integrated, realize electrical connection and performance optimization, and has become a major approach to surpass Moore’s Law. The U.S. government is strengthening its local supply chain in semiconductor, in which advanced packaging is an essential part. Semiconductor packaging is the sub-area that shows the smallest gap between China and the international leading level. However, as advanced packaging is shifting to front end of line technologies, which raises higher standards for equipment, materials and key components, China faces more challenges in advanced packaging, and is supposed to take effective measures to develop advanced packaging technologies, in case of being lagged behind.
Research Report, Issue No. 56, 2021. EU’s Course of Developing Generalized Scheme of Preferences and Its Enlightenment for China - 2021-12-23
Generalized System of Preferences (GSP) is an important pillar of WTO rules, under which developed countries offer general, non-discriminatory and non-reciprocal preferential tariff treatment to products originating in developing countries and regions to boost their economic development. The EU is the first economic entity to adopt GSP, through which almost all developing countries and regions, including China, received the EU’s preferential assistance. In the last 50 years of developing GSP, the EU continuously revised and adjusted the scheme catering to changes in its internal conditions and external situations, offering a model for preference-giving countries. Learning the course of EU developing its GSP and its latest trend will benefit China’s understanding of the EU’s overall foreign strategy and China’s high-quality development of foreign trade.
Research Report, Issue No. 55, 2021. Maintaining Resilient and Stable Industrial Chain and Supply Chain Connecting China, Japan and South Korea under the Latest Global Circumstances - 2021-12-23
In recent years, the global political and economic environment are experiencing drastic changes, with the trend of globalization in reverse, posing severe challenges to the traditional trade system, and showing regionalized, nearshoring, and localized trends in industrial and supply chains. The tremendous crack brought by the COVID-19 pandemic on global production network accelerates the reshaping of global industrial chain. After Joe Biden and his administration came into power, the U.S. government did not pause its containment on China’s development, but put more emphasis on allying with its allies to exclude China from global industrial chain, in which case Japan and South Korea become targets that the U.S. are trying to connect with. Under such complicated circumstances, it is critical for China to maintain resilient and stable industrial and supply chains connecting China, Japan and South Korea.